German quality assurance and testing group TÜV Rheinland has completed its investment in a new US base, the Technology and Innovation Centre located in Boxborough, Massachusetts. The project's initial phase was concluded in April of this year, with the facility, along with the relocation of its laboratory in Arkansas, set to be fully operational by the end of 2023.
Dr. Michael Fübi, CEO of TÜV Rheinland AG, emphasized the company's commitment to growth in North America, stating, “This expansion demonstrates our dedication to growth in North America. We believe that maintaining our leadership requires ongoing investment in innovative facilities and services that meet our customers' needs.”
The Massachusetts facility is equipped to conduct tests and certifications across various sectors, including electrical product safety, Medical Device Testing, EMC Testing, Robotics, Semiconductor Manufacturing, Photovoltaic Inverters, and Energy Storage.
Jonathan Kotbra, VP of products Americas at TÜV Rheinland North America, highlighted the significance of the multi-million dollar investment, underlining the company's commitment to serving existing customers and offering strategic solutions rooted in technology and innovation. Kotbra stated, “This laboratory empowers us, as industry leaders, to extend our offerings, providing expertise and comprehensive knowledge of regulations worldwide, expediting our customers' time to market.”
TÜV Rheinland's plans for testing operations expansion in the US were unveiled in December 2022 through a partnership announcement with PV research lab CFV Labs to bring certified PV testing to the US.
This development aligns with the company's broader strategy to enhance its testing capabilities in the United States and comes at a time when the renewables industry is scrutinizing manufacturing-side defects in solar PV modules. A recent report by US renewables firm Clean Energy Associates (CEA) highlighted an overall increase in manufacturing defects globally, with micro cracks, line cracking, and soldering errors identified as common issues. Of note was a nearly 50% spike in micro cracks observed in US modules tested by CEA between 2022 and mid-2023.
